byw4200b(-tr) ? august 1998 - ed : 2a high efficiency fast recovery diode i f(av) 4 a v rrm 200 v v f (max) 0.85 v main product characteristics suited to smps and drives surface mount package very low forward losses negligible switching losses high surge current capability tape and reel option : -tr features and benefits single chip rectifier suited to switch mode power supplies and high frequency converters. packaged in dpak, this surface mount device is intended for use in low voltage, high frequency in- verters, free wheeling and rectification applica- tions. description dpak (plastic) 4 1 2 3 symbol parameter value unit v rrm repetitive peak reverse voltage 200 v v rsm non repetitive surge reverse voltage 220 v i f(rms) rms forward current 10 a i f(av) average forward current tcase = 130c d = 0.5 4a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 70 a tstg storage temperature range - 40 to + 150 c tj maximum junction temperature 150 c absolute maximum ratings 2 4(tab) 3 1/3
symbol parameter value unit r th (j-c) junction to case 5 c/w thermal resistance symbol tests conditions tests conditions min. typ. max. unit i r * reverse leakage current tj = 25 cv r = v rrm 20 m a tj = 100 c 0.15 0.5 ma v f ** forward voltage drop tj = 25 ci f = 12 a 1.25 v tj = 100 ci f = 4 a 0.8 0.85 static electrical characteristics pulse test : * tp = 5 ms, d < 2 % ** tp = 380 m s, d < 2% to evaluate the maximum conduction losses use the following equation : p = 0.7 x i f(av) + 0.030 i f 2 (rms) symbol test conditions min. typ. max. unit t rr tj = 25c i f = 1a v f = 30v di f /dt = -50 a/ m s3035ns t fr tj = 25c i f = 1a v fr = 1.1 x v f tr = 10 ns 20 ns v fp tj = 25c i f = 1a tr = 10 ns 5 v recovery characteristics byw4200b(-tr) 2/3
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. package mechanical data dpak ref. dimensions millimeters inches min. typ. max min. typ. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 0.031 l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 foot print (in millimeters) 6.7 6.7 6.7 3 1.6 1.6 2.3 2.3 byw4200b(-tr) 3/3
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